Fairchild Imaging by BAE Systems develops and manufactures solid-state electronic imaging components, cameras, and systems. We are a company devoted to the creation of electronic imaging technology, development of that technology to production practicality, and manufacture to commercial success.
Since 2011, Fairchild Imaging has been part of BAE Systems, a global defence, aerospace and security company employing approximately 93,500 people worldwide. Our wide-ranging products and services cover air, land and naval forces, as well as advanced electronics, security, information technology, and support services. Coming together as one, Fairchild Imaging and BAE Systems offers a unique ability to provide an unmatched combination of solutions to government and commercial applications.
We are a descendent of the Fairchild family of companies, originally a part of Fairchild Semiconductor. In 1973, we brought semiconductor-based electronic imaging to commercial reality with the first commercially available CCDs. Since that achievement, our Fairchild Imaging Sensors and our OEM customers have introduced imaging technology and processes that have created whole new industries.
Innovation is a hallmark of our products and our patent portfolio is lengthy and broad. However, we take greatest pride in the conversion of our technology to successful production and the commercial application of our products.
Our OEM customers vary greatly in terms of market, location, size, product and technology requirements. We are serious about our customers’ business; all of our customers are viewed as strategic partners dedicated to mutual success. We view this as a solemn obligation on our part to perform at the highest level. Some of our customer relationships are two decades old.
We are based in a modern facility that is located in San Jose, California, within the heart of the Silicon Valley. Our facility is completely dedicated to the manufacture of electronic focal planes and electronic imaging systems. All of our sensor design and prototype engineering are done in our facility while wafer fabrication and higher volume packaging are outsourced for production efficiency and for lower costs. Resident manufacturing processes are maintained for specialty products and include semiconductor wafer dicing, packaging, device butting, fiber-optic element attachment, X-ray scintillator attachment, hybridization, and custom filter deposition. Additionally, our electronic imaging systems products, both standard and custom, are designed and manufactured in this facility.
Our design, fabrication and manufacturing team has been working together on complex, high performance CCDs for over 30 years; we know each other and know what it takes to execute a successful design. Our highly experienced technicians are experts in the field of focal plane packaging and testing. They routinely perform die attach and wire bonding on a variety of sizes of CCDs, fiber-optic attach as well as cleaning of sensitive die surfaces.
At the forefront of technology, our ultra-low noise CMOS (sCMOS) technology provides yet another imaging choice for our customers and their specific markets and applications. This technology complements the existing Fairchild Imaging line of large area, high performance CCD cameras and sensors.
We offer custom capabilities in solid state electronic imaging arrays suitable for diverse applications such as astronomical imaging, aerial reconnaissance, aerial mapping, spectrographic analysis, star tracking, missile seekers, dental and medical radiography, security and surveillance, x-ray diffraction and other state-of-the art military, industrial and scientific measurement applications.
We are certified ISO 9001:2008 and many of our camera products are CE or UL approved.